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ChipMOS Technologies Inc  

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August 2017 ChipMOS Technologies Inc Corporate Sales Release
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ChipMOS Technologies Inc at Credit Suisse Technology Conference
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Q2 2017 ChipMOS Technologies Inc Earnings Call (Chinese)
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Q2 2017 ChipMOS Technologies Inc Earnings Release
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July 2017 ChipMOS Technologies Inc Corporate Sales Release
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June 2017 ChipMOS Technologies Inc Corporate Sales Release
  

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CDP Score - -

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No. 1, R&D Road 1, Hsinchu Science Park
BAOSHAN, 308
Taiwan
+886-3-5770055 (�q��)
+886-3-5668981 (�ǯu)

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ChipMOS TECHNOLOGIES INC is a Taiwan-based company principally engaged in the integrated circuits packaging and testing business. The Company mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services, among others. The Company��s products and services are used in information products, personal computers, communications equipment, office automation and consumer electronics. It mainly operates its business within domestic market, and in overseas markets, including the rest of Asia and the Americas.

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Shijie Zheng Chairman of the Board, General Manager
Shoukang Chen Chief Financial Officer, Deputy General Manager
Lianfa Zhuo Chief Operating Officer, Executive Deputy General Manager
Guoliang Huang Deputy General Manager-Main Encapsulation Production Unit, Director
Lijun Li Executive Deputy General Manager-Operation & Production Center, Director
Yongwen Li Deputy General Manager-Main Wafer Bumping Production Unit, Director
Changlong Li Deputy General Manager-Information Technology Administration Center
Wei Wang Deputy General Manager-Research & Strategy Development Center
Wanhua Wu Deputy General Manager-New Product Development Management Center
Wuhong Xu Deputy General Manager-Main Random Access Memory Production Unit