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Kinsus Interconnect Technology Corp.  

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71.70
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October 2017 Kinsus Interconnect Technology Corp Corporate Sales Release (Estimated) �s�W�ܦ�ƾ�
2017�~10��23��
Q3 2017 Kinsus Interconnect Technology Corp Earnings Release (Estimated) �s�W�ܦ�ƾ�
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September 2017 Kinsus Interconnect Technology Corp Corporate Sales Release
2017�~9��6��
August 2017 Kinsus Interconnect Technology Corp Corporate Sales Release
2017�~9��5��
Kinsus Interconnect Technology Corp at Deutsche Bank dbAccess Taiwan Semiconductor & Automotive Corporate Day
2017�~8��4��
July 2017 Kinsus Interconnect Technology Corp Corporate Sales Release
2017�~7��25��
Q2 2017 Kinsus Interconnect Technology Corp Earnings Release
  

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CDP Score - -

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No.1245, Junghua Road, Shihlei Village
TAOYUAN, 327
Taiwan
+886-3-4871919 (�q��)
+886-3-4871920 (�ǯu)

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Kinsus Interconnect Technology Corp. is a Taiwan-based company principally engaged in the manufacture and distribution of ball grid array (BGA) substrates. The Company��s products portfolio consists of plastic BGA substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, cavity down substrates, thermal enhanced-BGA substrates, flip chip substrates and flip chip CSP substrates, as well as chip on flex (COF), among others. Its products are applied in the manufacture of chipsets, graphic chips, analog integrated circuits (ICs), logic ICs, flash memory products and dynamic random access memory (DRAM) products, among others. The Company distributes its products in domestic market and to overseas markets.

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Ming Dong Kuo Chairman of the Board, Chief Executive Officer
Gui-Qin Hu Chief Operating Officer
Qian-Wei Chang Chief Technology Officer
He-Xu Chen General Manager, Director
Geng-Fang Huang Senior Deputy General Manager
Sheng-Chuan Huang Deputy General Manager
Zhi-We Lin Deputy General Manager
Wei-Wen Wu Deputy General Manager
Tse-Hsien Tung Chief Strategic Officer, Director
Su-Zhen Liu Head of Finance & Accounting